What we did on our summer vacation
Tiwei Wei, Justin Weibel, Amy Marconnet, Ganesh Subbarayan
Thirteen Purdue students and six faculty traveled to Denver, CO for The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2024 and the Electronic Components and Technology Conference (ECTC) in May 2024. They shared their innovative research, presenting 17 papers at ITherm and 5 oral presentations at ECTC across a wide range of research topics from novel hot spot cooling approaches to new materials and measurement techniques relevant to advanced electronics packaging. Faculty shared their sought-after insight at panels: Prof. Amy Marconnet on “Thermal Challenges and Opportunities for Consumer Electronics/Mobile/IoT/Auto/High Power Compute” (ITherm), Prof. Kaz Yazawa on “Electronics Cooling for Large Scale Applications” (ITherm), Prof. Ganesh Subbarayan on “Mechanics and Co-Design Opportunities” (ITherm), and Prof. Tiwei Wei on “Efficient and Innovative Thermal Management for Power Hungry AI/ ML Applications: Challenges and Opportunities” (ECTC).

Purdue faculty are critical to the success of the conferences: Prof. Amy Marconnet served as Program Chair for ITherm, Prof. Tiwei Wei served as session chair for ITherm and on the program committee for ECTC, Prof. Tiwei Wei also chaired a highlighted session at ECTC on "Advanced Die-to-Wafer Hybrid Bonding for Heterogeneous Integration," which attracted over 400 attendees from both the semiconductor packaging industry and academia. Prof. Justin Weibel served as keynote co-chair at ITherm. Numerous Purdue alumni are also active in these conferences as organizers and attendees.
Our students also won many awards:
- Avram Bar Cohen Best Paper Award (in the Mechanics and Reliability Track) for “Accelerated Testing of Thermal Grease Degradation: Combined Thermal Gradients and Forced Mechanical Cycling”, P. P. Nagrani and A. Marconnet
- Best Paper Runner-Up Award (in the Component Level Thermal Management Track) for “Thermal characterization of two-phase cooling using embedded microchannels in a high current density electric motor,” by R. Regan, K. Saviers, W. Zhao, A. Kuczek, J. Tangudu, and J.A. Weibel
- Best Paper Runner-Up Award (in the System Level Thermal Management Track) for “Design and Characterization of a Thermal Test Vehicle with Embedded Phase Change Material,” by M. Bhatasana and A. Marconnet
- Best Paper Runner-Up Award (in the Emerging Technologies and Fundamentals Track) for “Characterization of enhanced two-phase jet impingement on femtosecond laser surface processed (FLSP) aluminum surfaces,” by A. Ceperley, G. Sahu, A. Reicks, C. Zuhlke, G. Gogos, and J.A. Weibel
- Best Poster Award (in the Component Level Thermal Management Track) for “Thermal characterization of two-phase cooling using embedded microchannels in a high current density electric motor,” by R. Regan, K. Saviers, W. Zhao, A. Kuczek, J. Tangudu, and J.A. Weibel
- Best Poster Runner-Up Award (in the Component Level Thermal Management Track) for “Modeling of backside power delivery and thermal management in semiconductor die packages,” by Z. Wu, X. Zhang, S. Tian, A.R. Kidambi, J.A. Weibel, and L. Pan
- ECTC Student Travel Award: "A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects" by Keyu Wang, Shuhang Lyu, and Tiwei Wei.

Alex Chortos
At the ASME Manufacturing Science and Engineering Conference (MSEC) in Knoxville, Tennessee, I presented an invited talk on the use of 3D printing for making bio-inspired soft electronics like 3D artificial muscles.
At TechConnect in Washington DC, my company PolyC Plastics and Composites received an award for the "Top 15% most innovative companies." Miko Cakmak and I, and a Purdue PhD student (Michael Sotzing), are scientific advisors for PolyC, and displayed product concepts and discussed with investors at the booth. TechConnect is America's premier conference for entrepreneurship and startup investment.
This summer, I joined with Monique McClain and Heather Liddell to run a summer course for high school students that teaches product design and entrepreneurship using 3D printing. 43 students designed a product, printed it, and pitched their product ideas to a panel of judges. As the top design, the judges chose a modular storage solution for wheelchairs, while students chose a project on custom cleats.
Andrea Vacca
One of my Ph.D. students (now graduated) Xin Tian became a finalist for the 2024 Giuseppe Pellizzi Prize, representing the best international Ph.D. thesis on agricultural mechanization. Her thesis was "Methods to reduce energy consumption in the hydraulic system: toward the next generation of green, high-efficient agricultural tractors."
Dave Cappelleri

We had a few trips this summer:
- IEEE International Conference on Robotics and Automation (ICRA), Yokohama, Japan
- NSF ERC IoT4Ag Annual Retreat, Merced, CA
- IEEE International Conference on Manipulation, Automation, and Robotics at Small Scales (MARSS), Delft, Netherlands (Fun fact: I will be organizing this conference next year at Purdue!)
I also received the official Guinness World Record for 3D printing the world's smallest drum!
David Warsinger

I also received the Bergles-Rohsenow Young Investigator Award in Heat Transfer at the ASME Summer Heat Transfer Conference in Anaheim, California.
Davide Ziviani

The Herrick Conferences took place here at Purdue just two weeks later, for which I served as chair of the International Refrigeration and Air Conditioning Conference. My students won several awards:
- Steven Liang, current PhD candidate at Herrick Labs co-advised by Jim Braun and myself, received the Best Paper Award in the International Compressor Engineering Conferences. He prototyped a novel reciprocating compressor with vapor injection that will enable next generation high-efficiency domestic refrigerators. He also received the Dave Tree Distinguished Service Award for his work in managing all the conferences’ papers, presentations, program and activities " the first time this award has been given to a student.
- Jan Spale is a PhD student from Czech Technical University in Prague and was a Fulbright Scholar at Herrick Labs for approximately 1 year under my supervision. He received the 2nd place in the Student Paper Competition, writing about high temperature heat pumps.
Eric Holloway
I was part of various teams that presented six papers at the American Society for Engineering Education (ASEE) Annual Conference in Portland, Oregon from June 23-26. Two of the papers that had the most significance for Mechanical Engineering were:
- A Framework for Students’ Professional Development When Meeting with Employers in a Microelectronics Workforce Development Program, co-authored by ME undergraduate Benjamin Burson (who I mentored for three semesters) and myself, focused on helping students in the Purdue-led SCALE microelectronic consortium prepare to meet with employers.
- Validity Evidence for the Sophomore Engineering Experiences Survey, co-authored by ME faculty Beth Holloway, myself, and our graduate student Fanyi Zhang, received Honorable Mention for the Best Paper in the Education Research and Methods (ERM) Division of ASEE. The ERM Division is generally considered the most stringent and has the most papers submitted for review.
Guillermo Paniagua

A good summer update from the team here at Purdue Experimental Turbine Aerothermal Laboratory (PETAL). Aubrey McKelvy and coauthors were awarded the Best Paper Award in “Controls, Diagnostics & Instrumentation” at the ASME Turbo Expo, which took place in London.
McKelvy A., Braun J., Paniagua G., Andre T., Choquet E., Falempin F., 2023, “Quantitative Definition of Spray Edge With Extinction Diagnostics for Liquid Jets in Supersonic Cross-flow”. Proceedings of the ASME Turbo Expo 2023. Paper GT2023-102536. Boston, USA. June. https://doi.org/10.1115/GT2023-102536
Junfei Li

I have several undergraduate students who won awards at NOISE-CON 2024 in New Orleans, the annual conference of the Institute of Noise Control Engineering (INCE-USA).
- Ruxin Li (incoming graduate student in my group, starting Fall 2024): Leo Beranek Student Medal for Excellence in Noise Control
- Shaocheng Wu (ME, Junior): Hallberg Foundation Award and Undergraduate Research Project Award
- Yijie Zhang (AE, Senior): Hallberg Foundation Award and Undergraduate Research Project Award
Partha Mukherjee

Steve Son
In June, I attended the Gordon Research Conference in Maine, focused on Understanding and Exploiting Structure, Property, and Novel Synthesis for Next Generation Energetic Materials. Our group had several posters presented and Diane Collard and Monique McClain were invited speakers.

Also in June, I attended the Workshop on Pyrotechnic Combustion where I gave an invited presentation, and the International Annual Conference of the Fraunhofer ICT, both in Karlsruhe, Germany.
In July I attended the International Pyrotechnic Society meeting in Albuquerque, New Mexico. Ph.D. student Bekah Travis gave a presentation and we had several posters.
In July I was an invited speaker at the 14th International Workshop on Combustion and Propulsion in Pescara, Italy.
Oh, and did I mention I got to visit an aircraft carrier?

Stuart Bolton

Thomas Siegmund

Xiulin Ruan
Two of my students won awards at the ASME Summer Heat Transfer Conference in Anaheim, California. Gilbreth Postdoctoral Fellow Dr. Xiaojie Liu received a K9 Session Presentation Award for her talk entitled “Low-emissivity colored paints enabled by conductive polymer coating for year-round energy-efficient buildings.” PhD student Andrea Felicelli received a K9 Session Presentation Award for her talk entitled “Structural Radiative Cooling in Highly Reflective White Snail Shells as Adaptation to Extreme Heat Environments.”

